Cutting

Metallurgy Sectioning blades

Application	A80-BH	A80-BM	A80-BS	A80-BN	A80-BT
for soft ferrous metals< HRC 30	for medium ferrous metals HRC 30 - 55	for especially hard ferrous metals > HRC 55	for non-ferrous metals and plastics	for titanium and titanium alloys

Please contact for size and pricing

CBN WAFERING BLADES

MEDIUM CONCENTRATION METAL BOND/RESIN BOND CONTINUOS RIM are recommended or sectioning of ferrous materials including high speed steels, inconel, stellite, iron and cobait base alloy, nickel base super alloys, led base alloys, titanium alloys and stainless steels.

HIGH CONCENTRATION - METAL BOND

continuous rim diamond wafering blades are recommended for agressive general laboratory sectioning of ductile materials, most metals,polymers, pc boards, thermal spray coatings and titanium.(Used on higher loads & speeds)

LOW CONCENTRATION - METAL BOND

continuous rim diamond wafering blades are recommended for sectioning very hard or brittle materials including ceramics, carbides, re-fractories, silicon, boron composites, glass and rock. (allows for higher loads being applied at sample interface). (Used on lower loads & speeds)

RESIN BOND DIAMOND WHEELS

continuous rim diamond blades are recommended for cutting of ferrous metals.

RESIN BONDED ABRASIVE CUT-OFF WHEELS

Uses aluminum oside or silicn carbide particles in a bakelite binder. These wheels are especially formulated to give the ideal cut surface finish for metallographic preparations. The 10", 12" and 17" wheels are designated as our special 'METCUT' series.